KOREA COUPLING.CO.,LTD

left_product
 
메뉴디자인

 

 


The BIB is DUT(Device Under Test) Board to check Devices of Semiconductor with high temperatures.

Many sockets are attached on the BIB, and there are many kinds of BIB as Static BIB, Dynamic BIB,

Mother BIB, Test BIB and Wafer BIB.

 

 

 

 (Unit : mm) 

Item Description Remark
Size 680 x 570 Max.
Layer 4L ~ 30L  
Thickness 1.6T Max. : 2.4T(MCC)
Drill Size 0.25mm Min. DUT(0.11mm)
Pin Pitch 0.65mm Min.DUT(0.3mm)
PCB Material FR-4 / Polyimide / High TG / Nelco


 

(Unit : mm) 

Item Description Remark
Layer 4L ~ 18L  
Thickness 1.6T 1.2T
(in case of under 0.35P)
Drill Size 0.25mm Min. DUT(0.11mm)
Pin Pitch 0.65mm Min.DUT(0.3mm)
PCB Material FR-4 / Polyimide / High TG / Nelco

 



 * Semiconductor IC Burn-in testing

   
   
새 페이지 1