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Hi Fix board is used for Testing process of Semi-conductor.
It is evaluated Electric Character as well as Electric Function of Device

 

(Unit : mm)

Item Description Remark
Size 400 x 500 Max.
Layer 52 L  
Thickness 3.5T / 6.2T Max.
Drill Size 0.15mm / 0.30mm Min.
Impedance Control +/- 10% Special +/- 5%
Pattern Pitch 0.35 mm  
PCB Material FR-4 / High TG / Hi-tg / Polyimide / Nelco





 
 * DDR3,4,5 /  * Cell & Core Test

   
   
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