KOREA COUPLING.CO.,LTD

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Description

Standard

Advanced

Inch(mm)

Inch(mm)

Material

FR-4, Hi-tg FR-4, Nelco, Polyimide

Max. Number of Layers

70 Layer

Min. Copper Thickness

1/3 oz (12)

Min. Dielectric Thickness

0.0039"(0.100mm)

0.0031"(0.08mm)

Min. Board Thickness

0.008"(0.2mm)

Max. Board Thickness

0.190"(4.8mm)

0.283"(7.2mm)

Board Thickness Tolerance(%)

10%

3.0T : 0.2mm

Layer to Layer Registration

0.0035"(0.089mm)

0.0025"(0.063mm)

Impedance Control

8%

5%

Warpage (inch per inch)

0.008"(0.2mm)

0.006"(0.15mm)

Imaging

Standard

Advanced

Inch(mm)

Inch(mm)

Min. Trace Width (a)

0.0028"(0.070mm)

0.002"(0.05mm)

Min. Trace Space (b)

0.0035"(0.089mm)

0.0028"(0.07mm)

Min. Annular Ring

0.004"(0.1mm)

0.0032"(0.07mm)

BGA Pitch

0.0158"(0.4mm)

0.012"(0.3mm)

Solder Mask

Standard

Advanced

Inch(mm)

Inch(mm)

Min. Solder Mask Dam (a)

0.004"(0.1mm)

0.003"(0.075mm)

Solder Mask Clearance (b)

0.002"(0.05mm)

0.0014"(0.035mm)

Min. SMT Pad Spacing (c)

0.0079"(0.2mm)

0.006"(0.15mm)

Solder Mask Thickness

0.0007"(0.018mm)

Hole

Standard

Advanced

Inch(mm)

Inch(mm)

Min. Hole Size

0.0059"(0.15mm)

0.0043"(0.11mm)

Hole Tolerance ()

0.003"(0.0762mm)

0.002"(0.051mm)

Aspect Ratio

21.3 : 1

27 : 1

Surface Finishing

Standard

Advanced

Inch(mm)

Inch(mm)

HASL

300" ~340" (7.0 ~ 8.0)

Immersion Gold

2" ~3" (0.05 ~ 0.076)

Gold Finger

30" ~ 50" (0.762 ~ 1.27)

Nickel Plating

150" ~ 300" (3.81 ~ 7.62)

Electronic Hard Gold

Max. 50"(1.27)

Out-Line

Standard

Advanced

Inch(mm)

Inch(mm)

Board Outline Tolerance()

0.008"(0.200mm)

Guide Rail

0.400" ~ 0.300"(10.0mm ~ 7.6mm)

Beveling

20, 30, 45

Panel Size

Standard

Advanced

Inch(mm)

Inch(mm)

Max. Panel Size

23.622"(600mm) x 31.496"(800mm)

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